Aluminum Nitride Ceramic AMB Copper-clad Substrate

Aluminum Nitride Ceramic AMB Copper-clad Substrate Puwei's Aluminum Nitride Ceramic AMB Copper-clad Substrate represents the forefront of thermal management for extreme power electronics. Engineered using Active Metal Brazing (AMB) technology, it bonds high-purity AlN ceramic with oxygen-free copper to create a superior platform for advanced Electronic Packaging. Core Advantages Extreme Thermal Conductivity: 170-200 W/m·K, 5-10x higher than Al₂O₃. Unmatched Bond Strength: >70 MPa peel strength ensures reliability in harsh conditions. Superior Thermal Cycling: Withstands over 5,000 cycles (-55°C to 150°C). Optimized CTE Match: Closely matches silicon and SiC, reducing stress in high-power microelectronic components. Technical Specifications Material & Core Properties Base Ceramic: High-purity Aluminum Nitride (AlN) Clad Material: Oxygen-Free High Conductivity Copper Thermal Conductivity: 170-200 W/(m·K) Bond Strength: >70 MPa (Peel) Dielectric Strength: >15…