Aluminum Nitride Ceramic Substrate For IGBT Power Modules

Aluminum Nitride Ceramic Substrate for IGBT Power Modules: Premium Thermal Management Solution Product Overview Puwei's Aluminum Nitride (AlN) Ceramic Substrate is engineered specifically for high-reliability IGBT Power Modules and advanced power electronics. As a cornerstone of modern Electronic Packaging, this substrate delivers unparalleled thermal conductivity (170-230 W/m·K) to efficiently dissipate heat from High-Power Microelectronic Components. Its exceptional electrical insulation, matched coefficient of thermal expansion (CTE) to silicon, and robust mechanical properties make it the optimal choice for demanding applications in electric vehicles, renewable energy, and industrial drives, ensuring system longevity and reliability. Why Choose Puwei AlN Substrates? Industry-Leading Thermal Conductivity: 170-230 W/(m·K) for maximum heat dissipation. Superior Reliability: Excellent CTE match to Si/SiC reduces thermal stress and failure. Comprehensive Metallization: Full range of…