Nickel-palladium-gold double-sided PCB

Overview of Electroless Nickel Palladium Gold Electroless nickel palladium gold is an important surface treatment process in the printed circuit board industry. It is widely used in the production process of hard circuit boards (PCB), flexible circuit boards (FPC), rigid scrambling boards, and metal substrates. It is also an important development trend of surface treatment in the printed circuit board industry in the future. Process and Mechanism Electroless nickel palladium gold is a non-selective surface treatment technology that deposits a layer of nickel, palladium, and gold on the surface of the copper layer of the printed circuit by chemical methods. The main process flow is: Degreasing Micro-etching Pre-dipping Activation Nickel plating Palladium plating Gold plating Drying There will be multi-stage washing treatment between each link. The mechanism of electroless nickel-palladium-gold reaction mainly includes redox reaction and displacement reaction. Among them, the reductio…